Expired70% confidenceFactExact time
Compared to the previous-generation MI300 series, the MI355X has improvements in memory bandwidth, compute density, and energy efficiency.
2
Sources
70%
Confidence
Medium-term (~90 days)
Relevance
7/7/2026
First Seen
This claim has expired. It is kept for the record and no longer describes the current state.
Valid until: 10/5/2026(expired)
Sources
AMD MI355X运行GLM5.2：推理成本仅为英伟达Blackwell的一半
hackernewshackernews7/3/2026
Related Claims
UnverifiedThe MI355X is equipped with HBM3e memory, with bandwidth reaching the order of several TB/s.70% similarUnverifiedThe AMD MI300X GPU's HBM memory capacity can reach up to 192GB.65% similarUnverifiedMiMo-V2.5 is a large model with over 300 billion (300B+) parameters.65% similarUnverifiedAMD MI300X通过将8个HBM3堆叠体封装于同一基板实现了192GB容量63% similarUnverifiedThe W25Q series (e.g., W25Q128 with 16MB capacity) are NOR Flash memory chips manufactured by Winbond Electronics, with read speeds of up to 50MB/s.63% similar
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