Verified65% confidenceFactExact time
Apple's M-series Ultra chips interconnect two Max chips via UltraFusion technology, achieving inter-chip bandwidth exceeding 2.5 TB/s through a silicon interposer.
3
Sources
65%
Confidence
Long-term
Relevance
7/17/2026
First Seen
Sources
Related Claims
UnverifiedM1 Ultra通过UltraFusion技术将两颗M1 Max芯片以硅中介层互连，实现内存容量与带宽双重翻倍78% similarVerifiedApple M系列芯片采用统一内存架构（UMA），CPU和GPU共享同一块高带宽内存池76% similarVerifiedThe M5 Ultra is very likely to adopt UltraFusion dual-chip interconnect packaging technology, combining two M5 Max-level chips into a single logical unit.75% similarUnverifiedThe Apple M2 Ultra chip integrates 134 billion transistors, and the NVIDIA H100 GPU contains 80 billion transistors74% similar
Cite This Claim
Stable URI
https://kongchang.com/claim/541083API
curl https://kongchang.com/api/v1/knowledge/claims/541083MCP
get_claim(id=541083)