Concept
3D NAND
A three-dimensional flash memory technology that achieves high-density storage by vertically stacking layers of memory cells. Its multilayer stacking approach has been borrowed for the design of three-dimensional structures in future logic chips.
Timeline (last 90 days)
Sep 10
Micron's 232-layer 3D NAND entered mass production in 2022, and the current industry-leading 3D NAND technology has achieved vertical stacking of more than 200 layers.
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