UltraFusion
Apple's proprietary chip interconnect technology that uses a silicon interposer to tightly package multiple discrete dies, causing the operating system to recognize them as a single chip. The technology is characterized by high interconnect density and low latency, and is used in the manufacture of M-series Ultra chips.
Core Facts
The UltraFusion inter-chip bandwidth of the M5 Ultra has increased from approximately 2.5 TB/s on the M3 Ultra to 4.4 TB/s, with a 6x improvement in connection density.
The M5 Ultra is very likely to adopt UltraFusion dual-chip interconnect packaging technology, combining two M5 Max-level chips into a single logical unit.
Timeline (last 90 days)
The UltraFusion inter-chip bandwidth of the M5 Ultra has increased from approximately 2.5 TB/s on the M3 Ultra to 4.4 TB/s, with a 6x improvement in connection density.
The M5 Ultra is very likely to adopt UltraFusion dual-chip interconnect packaging technology, combining two M5 Max-level chips into a single logical unit.
UltraFusion technology bridges the memory buses of two chips into a single address space through a silicon interposer, enabling available memory and bandwidth to approximately double linearly.
All Facts (3)
The UltraFusion inter-chip bandwidth of the M5 Ultra has increased from approximately 2.5 TB/s on the M3 Ultra to 4.4 TB/s, with a 6x improvement in connection density.
85%VerifiedThe M5 Ultra is very likely to adopt UltraFusion dual-chip interconnect packaging technology, combining two M5 Max-level chips into a single logical unit.
65%UnverifiedUltraFusion technology bridges the memory buses of two chips into a single address space through a silicon interposer, enabling available memory and bandwidth to approximately double linearly.
50%